Research / Organization

The Semiconductor Assembly Test Automation and Standardization Research Association (SATAS) is working to address the challenges of efficiency, availability, and manufacturability in semiconductor back-end manufacturing (package assembly and testing processes) by:
1. Advancing standardization across equipment and systems required for full automation
2. Developing prototypes and commercial models
3. Demonstrating pilot lines to validate automation, improve energy productivity, and reduce waste emissions

SATAS is transforming the design of production lines and their integration within factories by utilizing modularized manufacturing equipment cells and a mainframe that allows multi-layer stacking of these cells, combined with an Automated Material Handling System (AMHS). This approach enables highly productive andspace-efficient storage and transport of work-in-progress (WIP) within the factory. Each cell is uniformly designed with standardized height, width, and depth for optimal space utilization and can be easily added, removed, or replaced as needed. A complementary AMHS combines both overhead and ground-level transport to maximize overall efficiency.

Through these initiatives, SATAS aims to develop space-efficient and fully automated Package Assembly and Test Manufacturing processes, contributing to a more efficient, sustainable, and flexible semiconductor supply chain.

Typical Linked Package Assembly Equipment with Serial Material Movement

Vision：Co-Located Factories, Anywhere

• President: Kunimasa Suzuki (Former Chairman and CEO of Intel Japan)
• Director: Tomoki Takahashi (Project Director, National Security Policy Division and Mobility and Communications Policy Division, Mitsubishi Research Institute, Inc.)
• Director: Masahiko Hamashima (CEO of Semi Japan Ltd.)
• Auditor: Mieko Mio (Kioicho Law Office)