Innovation and Standardization in
Semiconductor Assembly Test
Purpose
Focusing on Semiconductor Package Assembly and Testing processes, which are critical to cost-effectiveness in semiconductor production, we are committed to driving standardization across equipment and systems essential for automation and operational efficiency. These standards will be validated through prototypes, commercial models, and pilot-line testing.
Advancing semiconductor package assembly and testing processes through technologies essential for back-end automation, open industry standards, and next-generation equipment—developing and implementing equipment, validating their performance on an integrated pilot line, and targeting commercialization from 2028 onward to improve energy productivity and reduce material waste bringing the knowledge and technologies gained from this project to both existing and new fabs.
News
- Two companies, Yodogawa Hutech and PROTEC, join as new members.
- NEDO announces decision on pilot line construction site and start of construction for “Post-5G Information and Communications System Infrastructure Strengthening Research and Development Project / Development of Advanced Semiconductor Manufacturing Technology / Research and Development on Development and Demonstration of Semiconductor Post-Process Automation and Standardization”
- Clean Technology joins as new member
- Omron Field Engineering Co., Ltd. joins as a new member
- Musashi Engineering and CKD join as new members
Message
Our research association was established in April 2024 with the mission of achieving operational efficiency, automation, and the standardization required to achieve these objectives in semiconductor manufacturing—particularly in the package assembly and testing stages of back-end processes—and translating these solutions into practical implementation. At the end of 2025, a total of 33 organizations, including domestic and international companies and the National Institute of Advanced Industrial Science and Technology, have joined this initiative.
As you are well aware, the strategic importance of semiconductors and their manufacturing technologies continues to grow from both geopolitical and technological perspectives. Among these, back-end processes in semiconductor manufacturing play a critical role in determining product performance and cost-effectiveness, making them an area of increasing focus and expectation for further technological progress.
In this context, our research association is committed to advancing operational efficiency and automation in the package assembly and testing processes by promoting standardization across equipment and systems, developing open industry standards and automation technologies, implementing next-generation equipment, and validating equipment performance through integrated pilot lines. Our objective is to enable practical deployment beginning in 2028 and contribute to the sustained growth of Japan’s semiconductor industry.
Achieving these ambitious goals in the rapidly evolving semiconductor sector requires the unwavering efforts of all our members, together with strong support from academic and industrial partners who share the vision and purpose of this association. We respectfully ask for your continued cooperation and support in the years ahead.
About
- Organization Name
- Semiconductor Assembly Test Automation and Standardization Research Association (SATAS)
- Established
- April 16, 2025
- Number of Members
- 33 companies (End of 2025)
- Objectives
- Promoting research and development related to the automation and standardization of semiconductor back-end processes, with a particular focus on the package assembly and testing stages. Focusing on processes that significantly impact the cost-effectiveness of semiconductor production, we are advancing standardization across equipment and system for operational efficiency and automation, and conduct validation through prototypes, commercial models and integrated pilot lines.
Access
- Headquarters (Secretariat)
- Location: Mitsubishi Research Institute, Inc.
2-10-3 Nagatacho, Chiyoda-ku, Tokyo, Japan
- Research and Development Base (Pilot Line)
- Location: Sharp Corporation Kameyama Site
464 Shiraki-cho Yukawa, Kameyama City, Mie Prefecture, Japan